| BODY HEIGHT | 1.3 MILLIMETERS MAXIMUM |
| BODY LENGTH | 1.8 MILLIMETERS MINIMUM AND 2.2 MILLIMETERS MAXIMUM |
| BODY STYLE | CHIP TYPE |
| BODY WIDTH | 1.1 MILLIMETERS MINIMUM AND 1.5 MILLIMETERS MAXIMUM |
| CAPACITANCE VALUE PER SECTION | 10.000 PICOFARADS SINGLE SECTION |
| DISSIPATION FACTOR AT REFERENCE TEMP IN PERCENT | 0.150 |
| INSULATION RESISTANCE AT MAXIMUM OPERATING TEMP | 1000.0 MEGOHMS |
| INSULATION RESISTANCE AT REFERENCE TEMP | 100000.0 MEGOHMS |
| MATERIAL | CERAMIC CASE |
| NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION | 100.0 DC SINGLE SECTION |
| NONDERATED OPERATING TEMP | -55.0 CELSIUS MINIMUM AND 125.0 CELSIUS MAXIMUM |
| RELIABILITY FAILURE RATE LEVEL IN PERCENT | 0.001 |
| RELIABILITY INDICATOR | ESTABLISHED |
| SCHEMATIC DIAGRAM DESIGNATOR | NO COMMON OR GROUNDED ELECTRODE(S) |
| TEMP COEFFICIENT OF CAPACITANCE PER SECTION IN PPM PER DEG CELSIUS | 0.0 SINGLE SECTION |
| TERMINAL LENGTH | 0.3 MILLIMETERS MINIMUM AND 0.7 MILLIMETERS MAXIMUM |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TERMINAL TYPE AND QUANTITY | 2 BONDING PAD |
| TOLERANCE OF TEMP COEFFICIENT PER SECTION IN PPM PER DEG CELSIUS | -30.0 TO 30.0 SINGLE SECTION |
| TOLERANCE RANGE PER SECTION | -5.00 TO 5.00 PERCENT SINGLE SECTION |