| CURRENT RATING PER CHARACTERISTIC | 200.00 MILLIAMPERES MAXIMUM COLLECTOR CURRENT, DC AND 50.00 MILLIAMPERES MAXIMUM BASE CURRENT, DC |
| INTERNAL CONFIGURATION | JUNCTION CONTACT |
| JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | SOT-23 |
| OVERALL HEIGHT | 1.1 MILLIMETERS MAXIMUM |
| OVERALL LENGTH | 2.8 MILLIMETERS MINIMUM AND 3.0 MILLIMETERS MAXIMUM |
| OVERALL WIDTH | 1.2 MILLIMETERS MINIMUM AND 1.4 MILLIMETERS MAXIMUM |
| MATERIAL | PLASTIC ENCLOSURE |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 CELSIUS JUNCTION |
| MOUNTING METHOD | TERMINAL |
| POWER RATING PER CHARACTERISTIC | 250.0 MILLIWATTS NOMINAL TOTAL POWER DISSIPATION |
| SEMICONDUCTOR MATERIAL | SILICON |
| SPECIAL FEATURES | JUNCTION PATTERN ARRANGEMENT: NPN |
| TERMINAL TYPE AND QUANTITY | 3 UNINSULATED WIRE LEAD |
| TRANSFER RATIO | 90.0 MINIMUM STATIC FORWARD CURRENT TRANSFER RATIO, COMMON-EMITTER |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 45.0 MAXIMUM BREAKDOWN VOLTAGE, COLLECTOR-TO-EMITTER, WITH BASE SHORT-CIRCUITED TO EMITTER AND 45.0 MAXIMUM BREAKDOWN VOLTAGE, COLLECTOR-TO-EMITTER, BASE OPEN AND 5.0 MAXIMUM BREAKDOWN VOLTAGE, EMITTER-TO-BASE, COLLECTOR OPEN |