| CURRENT RATING PER CHARACTERISTIC | -200.00 MILLIAMPERES NOMINAL COLLECTOR CURRENT, DC |
| INTERNAL CONFIGURATION | JUNCTION CONTACT |
| JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-236AB |
| OVERALL HEIGHT | 0.89 MILLIMETERS MINIMUM AND 1.11 MILLIMETERS MAXIMUM |
| OVERALL LENGTH | 2.80 MILLIMETERS MINIMUM AND 3.04 MILLIMETERS MAXIMUM |
| OVERALL WIDTH | 2.10 MILLIMETERS MINIMUM AND 2.50 MILLIMETERS MAXIMUM |
| MATERIAL | PLASTIC ENCLOSURE |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 CELSIUS JUNCTION |
| MOUNTING METHOD | TERMINAL |
| POWER RATING PER CHARACTERISTIC | 300.0 MILLIWATTS NOMINAL TOTAL POWER DISSIPATION |
| SEMICONDUCTOR MATERIAL | SILICON |
| SPECIAL FEATURES | JUNCTION PATTERN ARRANGEMENT: PNP |
| TERMINAL TYPE AND QUANTITY | 3 PRINTED CIRCUIT |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | -40.0 NOMINAL BREAKDOWN VOLTAGE, COLLECTOR-TO-EMITTER, BASE OPEN AND -40.0 NOMINAL BREAKDOWN VOLTAGE, COLLECTOR-TO-BASE, EMITTER OPEN AND -5.0 NOMINAL BREAKDOWN VOLTAGE, EMITTER-TO-BASE, COLLECTOR OPEN |